1. Demonstration of p-type GaN FinFETs on Silicon Substrates with Ultrahigh Current ON/OFF Ratio of 109 and Reduced Interface Trap Density. 2023 7TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM. Du, Hanghai; Liu, Zhihong; Zhang, Tao; Hao, Lu; Gao, Guangjie; Xing, Weichuan; Zhang, Jincheng; Hao, Yue

2. Atomic-Scale Study on Amorphous ZrO2/TaON Interface for Ferroelectric-Like Insulator Films. 2023 7TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM. Gong, Zhi; Chen, Jiajia; Jin, Chengji; Liu, Huan; Liu, Yan; Yu, Xiao; Han, Genquan

3. A Comprehensive Simulation Study on Capacitive Memory with Metal-Ferroelectric-Insulator-Semiconductor Structure. 2023 7TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM. Zhang, Hongrui; Jin, Chengji; Jia, Xiaole; Chen, Jiajia; Liu, Huan; Liu, Yan; Yu, Xiao; Han, Genquan

4. Ferroelectric-like Behaviors of Mobile-Ionic Field-Effect Transistors with Amorphous Dielectrics. 2023 7TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE, EDTM. Liu, Huan; Jin, Chengji; Chen, Jiajia; Yu, Xiao; Li, Jing; Peng, Yue; Cheng, Ran; Chen, Bing; Liu, Yan; Hao, Yue; Han, Genquan

5. Complete Reconfigurable Boolean Logic Gates Based on One FeFET -One RRAM Technology. IEEE 53RD EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE, ESSDERC 2023. Zeng, Yiqin; Ding, Zhetao; Li, Xueyang; Ma, Minglei; Peng, Yue; Shen, Rongzong; Lin, Gaobo; Jin, Chengji; Yu, Xiao; Chen, Bing; Cheng, Ran; Han, Genquan

6. Reconfigurable Intelligent Surface-Aided Spectrum Sharing Coexisting with Multiple Primary Networks. 2023 IEEE WIRELESS COMMUNICATIONS AND NETWORKING CONFERENCE, WCNC. Tian, Zhong; Chen, Zhengchuan; Wang, Min; Jia, Yunjian; Wen, Wanli

7. An online deep learning based channel estimation method for mmWave massive MIMO systems. 2023 IEEE 97TH VEHICULAR TECHNOLOGY CONFERENCE, VTC2023-SPRING. Bai, XuDong; Peng, Qi